Devices with Radiating Systems Proximate to Conductive Bodies

ABSTRACT

A device includes a radiating system comprising: at least one of a radiation booster or a radiating element; a ground plane layer having at least two connecting points; a radiofrequency system electrically connected to the radiation booster and/or the radiating element and comprising at least one matching network; at least one external port electrically connected to the radiofrequency system; and at least first and second electrically conductive elements each comprising one or more components and being adapted to electrically connect first and second connecting points, respectively, of the at least two connecting points to an electrically conductive body of an apparatus at a distance from the ground plane layer, the distance being less than λ/15, wherein K is a free-space wavelength at a lowest frequency of operation of the radiating system.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/994,870, filed Nov. 28, 2022, which is a continuation of U.S. patentapplication Ser. No. 16/862,064, filed on Apr. 29, 2020, now U.S. Pat.No. 11,532,877, which is a continuation of International Application No.PCT/EP2018/079760, filed on Oct. 30, 2018, which claims priority under35 U.S.C. § 119 to Application No. EP 17199281.1 filed on Oct. 30, 2017,and also claims the benefit of U.S. Provisional Application No.62/578,538, filed on Oct. 30, 2017, the entire contents of which arehereby incorporated by reference.

TECHNICAL FIELD

The present invention relates to the field of electronic devices. Morespecifically, the present invention relates to electronic devices with aradiating system adapted to operate while being close to electricallyconductive bodies or surfaces.

BACKGROUND

In many applications, electronic devices, such as wireless electronicdevices, are not operated in a free-space scenario, but are operated inclose proximity to a supporting body. For instance, a wireless routermight be placed on a table, and an IoT (Internet of Things) or mobiletransceiver might be placed over a conductive body such as arefrigerator, a washing machine, the roof of a car, the bodywork of anairplane, rocket or ship and alike. In the last cases, when the deviceis close to a conductive body, the efficiency of the radiating systemprovided by the wireless device decreases dramatically the closer thedevice is to the electrically conductive body (e.g. Aluminum, Copper,etc.) in terms of the operation wavelength of the radiating system. Notonly the efficiency is negatively affected, but also the input impedancechanges when such a device is placed close to the conductive body. Thisis due to the existence of electric currents flowing in the conductivebody that, in most cases, are out-of-phase with respect to the electriccurrents flowing in the ground plane of the device. The effects of closeproximity may appear for instance when a distance between the radiatingsystem of the device and the conductive body is smaller than λ/10, andmore significant if the distance is even smaller, such as smaller thanλ/15, smaller than λ/20, and/or smaller than λ/30, where X (i.e. lambda)is the operation wavelength of the radiating system. In summary, thereare two main negative effects when operating a wireless device close toa conductive body: a low radiation efficiency (e.g. below 30%) and asever impedance mismatch, resulting in an overall antenna efficiencytypically below 20% and/or even below 10%.

Thus, a device including a radiating system capable of operating inclose proximity to an electrically conductive body would be anadvantageous solution suitable for covering a large range ofapplications and real market needs.

There are prior-art antenna technologies that are intended to operate insuch environments, for example artificial magnetic conductors,meta-surfaces or metamaterials, EBG (electromagnetic band gap)structures and alike. Some of the main disadvantages of these structuresare their dimensions and that their particular properties as specialstructures apply in a narrow band. Other technical solutions for makingantennas capable of operating proximate to conductive bodies consist inincluding a shielding ground plane in the design of the antenna systemso that it becomes immune to their effect. These solutions are usuallynarrow band as well and the performance achieved in terms of efficiencyis improvable.

There is an interest in providing devices with a radiating system thatare capable of operating close to an electrically conductive body, whichattain both good efficiencies and matching performance, and which maycover large bandwidths of operation at one or more frequency regions.

SUMMARY

It is an object of the present invention to provide a device, forinstance a wireless device, with a radiating system capable of operatingin close proximity to an electrically conductive body such that theradiating system may attain good efficiencies and matching performance.

A first aspect of the invention relates to a device including aradiating system, the radiating system comprising: at least oneradiation booster or radiating element; a ground plane layer having atleast two connecting points; a radiofrequency system electricallyconnected to the at least one radiation booster or radiating element andcomprising at least one matching network; at least one external portelectrically connected to the radiofrequency system; and at least twoelectrically conductive elements, each of the at least two electricallyconductive elements comprising one or more components; first and secondelectrically conductive elements of the at least two electricallyconductive elements being adapted to electrically connect first andsecond connecting points, respectively, of the at least two connectingpoints to an electrically conductive body of an apparatus at a distancefrom the ground plane layer, the distance being smaller than λ/10,wherein λ is a free-space wavelength at a lowest frequency of operationof the radiating system.

The device of the present disclosure may attain better radioelectricperformance than devices of the prior art that include at least oneradiation booster or radiating element and whose radiating system isproximate to an electrically conductive body of an apparatus,particularly proximate regarding the operating wavelength.

The ground plane layer of the radiating system is provided with aplurality of connecting points (e.g. 2, 3, 4 or more connecting points).Each of these connecting points is in electrical contact with theelectrically conductive body of the apparatus by means of one or morecomponents that provide an electrically conductive element.

The at least two electrically conductive elements (e.g. 2, 3, 4 or moreelectrically conductive elements) are spaced apart and intended to alterthe electric currents induced on the surface of the electricallyconductive body, thereby altering the electric currents in the groundplane layer. The latter is due to the fact that the proximity betweenthe radiating system and the electrically conductive body in terms ofthe free-space wavelength of operation results in the coupling of theelectric currents in the body to the ground plane layer. Each of the atleast two electrically conductive elements may be selected in order toadjust how the electric currents induced on the surface of the body arealtered so that at least some of the electric currents flowing thereinare in-phase with respect to at least some electric currents induced inthe ground plane layer by the at least one radiation booster orradiating element. In this sense, the altered electric currents maypartially or completely cancel out part of the electric currents flowingin the electrically conductive body, thereby reducing the amount ofelectric currents flowing out-of-phase with respect to at least someelectric currents induced in the ground plane layer by the at least oneradiation booster or radiating element; or, in some cases, a majority ofthe electric currents in the electrically conductive body are altered soas to be in-phase with respect to at least some electric currentsinduced in the ground plane layer by the at least one radiation boosteror radiating element, thereby improving the radioelectric performance ofthe device even more. Therefore, the electrical connections are not madefor connecting two different ground planes as in prior art devices, butfor altering electric currents of the apparatus so as to improve theradioelectric performance of the device when it is proximate thereto.

The at least two connecting points and the connections thereof to theelectrically conductive body are, in some embodiments, additionallyconfigured so as to establish different paths for the currents to followdepending on their wavelength or frequency. Accordingly, depending onthe paths followed by the currents and the wavelength or frequencythereof, additional bandwidth is provided due to the increased number ofcurrents corresponding to other wavelengths or frequencies flowing inthe ground plane layer or the electrically conductive body, therebyimproving the electromagnetic radiation capabilities of the device.Therefore, in these cases, if the electromagnetic radiation capabilitiesof the device in free-space conditions and in close proximity to theelectrically conductive body are compared, the latter have a broaderbandwidth of operation or additional one or more bands of operation.Such additional configuration and improvement are also possible when theat least two connecting points comprise more than two connecting points,since the provision of more connecting points makes possible to furtheradjust the number and lengths of the paths followed by the electriccurrents; for example, in embodiments in which the ground plane layercomprises four or more connecting points (i.e. the at least twoconnecting points comprise four or more connecting points) there isfurther flexibility in the configuration of the paths.

In some embodiments, the at least two connecting points comprise atleast three connecting points (i.e. at least first, second and thirdconnecting points). In these embodiments, the at least two electricallyconductive elements comprise at least three electrically conductiveelements (i.e. at least first, second and third electrically conductiveelements). Further, first, second and third electrically conductiveelements of the at least three electrically conductive elements areadapted to electrically connect the first, the second and the thirdconnecting points, respectively, to the electrically conductive body ofthe apparatus.

The provision of three or more connecting points may further adjust thealteration of the electric currents in the electrically conductive body,thereby making possible to further improve the radioelectric performanceof the device. As the connecting points are spaced apart, theelectrically conductive elements connecting them to the body change theelectric currents at those locations. Accordingly, the device may beconfigured with respect to a wider range of types of electricallyconductive bodies (in terms of both size and material), a wider range ofground plane layers (in terms of both size and material), and/or a widerrange of distances between the radiating system and the electricallyconductive body (a shorter or greater distance between the two affectsthe performance of the radiating system; the distance is always smallerthan λ/10).

In some embodiments, the at least one radiation booster or radiatingelement comprises a single radiation booster element. In someembodiments, the at least one radiation booster or radiating elementcomprises two or three radiation booster elements electricallyconnected.

Both the radiation booster element(s) and the radiating element(s) havetheir radioelectric performance influenced by a proximate electricallyconductive body. However, in some cases the radiation booster element(s)is/are more influenced than the radiating element(s) due to theirsubstantial reliance upon the ground plane layer as the radiationbooster element(s) excite radiation modes in the ground plane layer.

Several radiation booster elements may be arranged side-by-side andelectrically connected so that the radiation modes are exciteddifferently.

In some embodiments, the at least one radiation booster or radiatingelement comprises a radiating element.

Radiating elements also have their radioelectric performance improvedwith a device according to the present disclosure. Radiating elementshave a size equal to or greater than λ/15, wherein λ is a free-spacewavelength at a frequency of operation of the radiating system. When theradiating element or elements have a size equal to or greater than λ/8,the radiating element or elements are antennas (e.g. monopoles).

In some embodiments, the radiating system further comprises a feedingsystem that electrically connects the at least one external port to theradiofrequency system.

The feeding system, which may consist of e.g. a transmission line, amicro coaxial cable, etc. may be provided for improving theradioelectric performance of the radiating system. The at least oneexternal port may be provided at a location of a printed circuit board(on which the radiating system is provided) free from ground plane layerbut proximate to it where fewer electric currents or electric currentswith lower intensity flow. Such location may be advantageous for the atleast one external port because the electronics of any device using theradiating system, e.g. a modem, are less affected by the electriccurrents and, thus, the overall performance of said device together withthe radiating system is improved. The feeding system electricallyconnects the at least one external port (at the location where it isprovided) to the radiofrequency system.

In some embodiments, the first connecting point of the at least twoconnecting points is at a first half of the ground plane layer in alengthwise dimension thereof, and the second connecting point of the atleast two connecting points is at a second half of the ground planelayer in the lengthwise dimension thereof.

The electric currents are altered in the electrically conductive bodybased on the location of the connecting points (and also based on theelectrically conductive elements making the connection), thus by spacingapart the connecting points by providing the same in the two halves ofthe ground plane layer along its lengthwise dimension (such that greaterseparation may be provided) the alteration of electric currents to makethem be in-phase with at least some electric currents induced in theground plane layer by the at least one radiation booster or radiatingelement may be improved. In some examples, the connecting points areprovided proximate to an axis along the lengthwise dimension and passingthrough a center of the ground plane layer; accordingly, each connectingpoint is in a different half and substantially at the middle of theground plane layer in the width dimension thereof. In some of theseexamples, the connecting points are provided at about the center of eachhalf of the ground plane layer.

In some embodiments, the at least two connecting points comprise atleast three connecting points; and the at least two electricallyconductive elements comprise at least three electrically conductiveelements, a third of the at least two electrically conductive elementsbeing adapted to electrically connect the third connecting point to theelectrically conductive body. In some of these embodiments, a first ofthe at least three connecting points is at a first third of the groundplane layer in a lengthwise dimension thereof, a second of the at leastthree connecting points is at a second third of the ground plane layerin the lengthwise dimension thereof, and a third of the at least threeconnecting points is at a third third of the ground plane layer in thelengthwise dimension thereof.

When at least three connecting points are provided, they may be spacedapart by providing each one of them on a different third of the groundplane layer along the lengthwise dimension. In some examples, theconnecting points are provided proximate to an axis along the lengthwisedimension and passing through a center of the ground plane layer;accordingly, each connecting point is in a different third andsubstantially at the middle of the ground plane layer in the widthdimension thereof.

In some embodiments, the first connecting point of the at least threeconnecting points is at a first distance in a width direction of theground plane layer and at a second distance in the lengthwise dimensionof the ground plane layer, the first distance being between ⅓ and ⅔ (theendpoints being included) of a width of the ground plane layer, thesecond distance being between 0 and ⅙ (the endpoints being included) ofa length of the ground plane layer; the second connecting point of theat least three connecting points is at the first distance in the widthdirection of the ground plane layer and at a third distance in thelengthwise dimension of the ground plane layer, the third distance beingbetween 5/12 and 7/12 (the endpoints being included) of the length ofthe ground plane layer; and the third connecting point of the at leastthree connecting points is at the first distance in the width directionof the ground plane layer and at a fourth distance in the lengthwisedimension of the ground plane layer, the fourth distance being between ⅚and 6/6 (the endpoints being included) of the length of the ground planelayer.

In this way, two connecting points are close to opposite edges (thatextend in a direction corresponding to a width of the ground planelayer) of the ground plane layer, whereas another connecting point is atabout the center of the ground plane layer. This distribution ofconnecting points makes possible to attain a greater cancelling effectof the electric currents induced on the surface of the electricallyconductive body.

In some embodiments, the at least two connecting points comprise four ormore connecting points (i.e. first, second, third and fourth, andpossibly even further connecting points); the at least two electricallyconductive elements comprise as many electrically conductive elements(i.e. first, second, third and fourth, and possibly even furtherelectrically conductive elements) as there are connecting points in theat least two connecting points, each electrically conductive elementbeing adapted to electrically connect one of the four or more connectingpoints to the electrically conductive body.

In some embodiments, the first connecting point of the four or moreconnecting points is at a first fourth of the ground plane layer in thelengthwise dimension thereof, the second connecting point of the four ormore connecting points is at a second fourth of the ground plane layerin the lengthwise dimension thereof, the third connecting point of thefour or more connecting points is at a third fourth of the ground planelayer in the lengthwise dimension thereof, and the fourth connectingpoint of the four or more connecting points is at a fourth fourth of theground plane layer in the lengthwise dimension thereof.

When at least four connecting points are provided, they may be spacedapart by providing each one of them on a different fourth of the groundplane layer along the lengthwise dimension. In some examples, theconnecting points are provided proximate to an axis along the lengthwisedimension and passing through a center of the ground plane layer;accordingly, each connecting point is in a different fourth andsubstantially at the middle of the ground plane layer in the widthdimension thereof.

When the at least two connecting points comprise five or more connectingpoints, these may be spaced apart by providing each one of them on adifferent fifth of the ground plane layer along the lengthwisedimension; alternatively, they may be spaced apart but some of thembeing provided in a same half, third, fourth or fifth of the groundplane layer along the lengthwise dimension, thus two or more connectingpoints may share such half, third, fourth or fifth.

In some embodiments, each of the at least two electrically conductiveelements (e.g. first, second, third, fourth, and/or even furtherelectrically conductive elements) comprises a single component, thecomponent being a via or alike (e.g. screw, electrically conductivefoam, electrically conductive plate, etc.).

The connection(s) of the ground plane layer with the electricallyconductive body with vias, such as wire-made vias, screws, foams,plates, etc. alters the electric currents of the electrically conductivebody (and, thus, in the ground plane layer). The use of such componentstherefore makes possible to improve the radioelectric performance acrossa part or the entirety of the bandwidth(s) of operation of the radiatingsystem.

In some embodiments, one, some or all of the at least two electricallyconductive elements (e.g. first, second, third, fourth, and/or evenfurther electrically conductive elements) comprises one of: a switch, acapacitor, an inductor, a resistor, a filter (e.g. low pass filter, highpass filter, band pass filter, stop band filter), a via or alike, and acombination thereof; and each of remaining electrically conductiveelements of the at least two electrically conductive elements comprisesa single component, the component being a via or alike.

The use of electrical components aside from vias or alike makes possibleto further adjust how the electric currents are altered in theelectrically conductive body (and, thus, in the ground plane layer) indifferent situations or for different frequencies, hence making possibleto selectively adjust the behavior of the electric currents.Accordingly, the radioelectric performance of the radiating system maybe improved with different adjustments corresponding to differentsituations or frequencies. Such electrically conductive elements thusprovide additional ways for configuring and optimizing the performanceof the radiating system and, therefore, the device when the radiatingsystem is in close proximity to the electrically conductive body.

With the switch, it is possible to selectively connect the connectingpoint to the electrically conductive body and disconnect the connectingpoint from the electrically conductive body. To this end, electronicscontrolling the switch selectively change the configuration of theswitch in accordance with a set of conditions or constraints set therein(making or releasing the connection when e.g. a specific bandwidth orwireless communication channel is being operated, a change in thecurrents flowing is detected with a sensor, etc.).

With inductor(s) and/or capacitor(s), the electrical connection betweenthe connecting point and the electrically conductive body is madethrough reactive coupling, either inductive coupling or capacitivecoupling. For example, the provision of inductor(s) may result in theelectrical connection of the corresponding connecting point(s) to theelectrically conductive body mostly at lower frequencies, therebyaltering the electric currents with said connecting point(s) mostly whenthe radiating system operates at such lower frequencies; whereas theprovision of capacitor(s) may result in the electrical connection of thecorresponding connecting point(s) to the electrically conductive bodymostly at higher frequencies, thereby altering the electric currentswith said connecting point(s) mostly when the radiating system operatesat such higher frequencies. Similarly, by providing a filter, theconnection between the ground plane layer and the electricallyconductive body is made for a range of frequencies, thus e.g. with a lowpass filter only electric currents of lower frequencies may use the pathwith the filter therein, or with a stop band filter only electriccurrents of determined frequencies may not use the path with the filtertherein.

The provision of resistors is advantageous for manually establishing orreleasing the connection. By way of example, the resistor may beprovided in series with a via or the like and be removed therefrom andsoldered back again for changing the establishment of said connection.Preferably the resistors have a resistance as low as possible, includingbut not limited to 0 ohms resistors and the like.

It is possible to provide a plurality of the aforementioned componentsin one electrically conductive element so as to combine the effectsthereof without departing from the scope of the present disclosure; byway of example, an inductor may be provided together with a switch, or afilter be provided together with a via or the like.

In those embodiments in which the at least two electrically conductiveelements comprise two electrically conductive elements, one or both ofthem may include one or more components in the form of a switch, acapacitor, an inductor, a resistor, a filter, a via or the like, or acombination thereof. In those embodiments in which the at least twoelectrically conductive elements comprise three electrically conductiveelements, one, two or all three of them may include one or more of theaforementioned components. In those embodiments in which the at leasttwo electrically conductive elements comprise four or more electricallyconductive elements, one, several (e.g. two, three, etc.) or all of themmay include one or more of the aforementioned electrical components.

In some embodiments, the distance is smaller than λ/15. In some of theseembodiments, the distance is smaller than λ/20. In some of theseembodiments, the distance is smaller than λ/30.

The distance between the ground plane layer of the device and theelectrically conductive (and, thus, the distance between the device andthe apparatus) is made smaller in order to reduce the space and volumeneeded by both. However, the electric currents flowing in the latter arecoupled to the former with a greater intensity, thereby decreasing theradioelectric performance of the radiating system. A device according tothe present disclosure may provide an enhanced radioelectric performancewith respect to devices of the prior art even if the distance is assmall as aforementioned. In some cases, the distance is at least equalto or greater than λ/100, for example equal to or greater than λ/50.

In some embodiments, a lowest frequency of operation of the radiatingsystem is equal to or greater than 50 MHz and is less than 100 GHz.

In some embodiments, the radiating system at least operates or furtheroperates from 824 MHz to 960 MHz.

The radiating system at least transmits and/or receives electromagneticwave signals in a frequency band ranging from 824 MHz to 960 MHz, whichis used for cellular communications. As it is known by the skilledperson, the influence of the electrically conductive body on theradiating system depends upon the frequencies of operation of theradiating system.

In some embodiments, the radiating system at least operates or furtheroperates from 698 MHz to 960 MHz.

In some embodiments, the radiating system at least operates or furtheroperates from 1710 MHz to 2690 MHz.

The radiating system further transmits and/or receives electromagneticwave signals, or at least transmits and/or receives electromagnetic wavesignals, in a frequency band ranging from 1710 MHz to 2690 MHz, which isused for cellular communications.

In some embodiments, the device is a wireless device. In some of theseembodiments, the wireless device is a portable wireless device.

In some embodiments, a width of the electrically conductive body isgreater than a width of the ground plane layer, and a length of theelectrically conductive body is greater than a length of the groundplane layer. In some of these embodiments, the width of the electricallyconductive body is smaller than 100 times the width of the ground planelayer, and the length of the electrically conductive body is smallerthan 100 times the length of the ground plane layer. In some of theseembodiments, the width of the electrically conductive body is smallerthan any one of the following: 50 times, 25 times, 10 times, 5 times and2 times the width of the ground plane layer; and the length of theelectrically conductive body is smaller than any one of the following:50 times, 25 times, 10 times, 5 times and 2 times the length of theground plane layer.

As the surface of the electrically conductive body is comparable orlarger than the ground plane layer, the performance of the radiatingsystem worsens owing to the coupling of electric currents induced on thesurface of the body.

A second aspect of the invention relates to a system comprising: adevice according to the first aspect of the invention; and an apparatuscomprising an electrically conductive body.

In some embodiments, a width of the electrically conductive body isgreater than a width of the ground plane layer, and a length of theelectrically conductive body is greater than a length of the groundplane layer. In some of these embodiments, the width of the electricallyconductive body is smaller than 100 times the width of the ground planelayer, and the length of the electrically conductive body is smallerthan 100 times the length of the ground plane layer. In some of theseembodiments, the width of the electrically conductive body is smallerthan any one of the following: 50 times, 25 times, 10 times, 5 times and2 times the width of the ground plane layer; and the length of theelectrically conductive body is smaller than any one of the following:50 times, 25 times, 10 times, 5 times and 2 times the length of theground plane layer.

In some embodiments, the apparatus is one of: a smart TV, arefrigerator, a fridge, a washing machine, a drying machine, agas-meter, a water-meter, an electricity-meter, a motor vehicle, atrain, an airplane, a rocket, and a ship.

The electrically conductive body is e.g. a plate of any one of the TV,the refrigerator, the washing machine, the drying machine, thegas-meter, the water-meter, the electricity-meter, a roof or a bodyworkof any one of the motor vehicle, the train, the airplane, the rocket,the ship, etc. In many embodiments, the electrically conductive body isprovided as a shielding or a ground plane, and in some embodiments theelectrically conductive body is at least one ground plane layer of aprinted circuit board within the apparatus.

Similar advantages as those described for the first aspect of theinvention are also applicable to this aspect of the invention.

A third aspect of the invention relates to a method comprising:providing a device including a radiating system, the radiating systemcomprising: at least one radiation booster or radiating element; aground plane layer; a radiofrequency system electrically connected tothe at least one radiation booster or radiating element and comprisingat least one matching network; and at least one external portelectrically connected to the radiofrequency system; providing theground plane layer with at least two connecting points; providing anapparatus, the apparatus comprising an electrically conductive body;providing at least two electrically conductive elements, each of the atleast two electrically conductive elements comprising one or morecomponents; and connecting a first of the at least two connecting pointsto the electrically conductive body with a first of the at least twoelectrically conductive elements, and a second of the at least twoconnecting points to the electrically conductive body with a second ofthe at least two electrically conductive elements; the device beingprovided such that the ground plane layer is at a distance from theelectrically conductive body, the distance being smaller than λ/10,wherein λ is a free-space wavelength at a lowest frequency of operationof the radiating system.

The method makes possible to provide the device in close proximity tothe apparatus yet reduce the decrease in radioelectric performance ofthe device due to the coupling of electric currents induced on thesurface of the electrically conductive body to the radiating system.

The provision of both the at least two connecting points (e.g. 2, 3, 4or more connecting points) and the at least two electrically conductiveelements (e.g. 2, 3, 4 or more electrically conductive elements), andthe use of the latter to connect the ground plane layer to theelectrically conductive body makes possible to alter at least someelectric currents on the surface of the electrically conductive bodysuch that they are in-phase with respect to at least some electriccurrents induced in the ground plane layer by the at least one radiationbooster or radiating element. As the electric currents are coupled fromthe electrically conductive body to the ground plane layer, the electriccurrents as altered are coupled.

In some embodiments, the step of providing the ground plane layer withat least two connecting points comprises providing the ground planelayer with: the first of the at least two connecting points at a firsthalf of the ground plane layer in a lengthwise dimension thereof; andthe second of the at least two connecting points at a second half of theground plane layer in the lengthwise dimension thereof.

In some embodiments, the at least two connecting points comprise atleast three connecting points. In these embodiments, the at least twoelectrically conductive elements comprise at least three electricallyconductive elements; and the method further comprises connecting thefirst of the at least three connecting points to the electricallyconductive body with the first of the at least three electricallyconductive elements, the second of the at least three connecting pointsto the electrically conductive body with the second of the at leastthree electrically conductive elements, and a third of the at leastthree connecting points to the electrically conductive body with a thirdof the at least three electrically conductive elements.

In some embodiments, the first connecting point of the at least threeconnecting points is at a first third of the ground plane layer in alengthwise dimension thereof, the second connecting point of the atleast three connecting points is at a second third of the ground planelayer in the lengthwise dimension thereof, and the third connectingpoint of the at least three connecting points is at a third third of theground plane layer in the lengthwise dimension thereof.

In some embodiments, the first connecting point of the at least threeconnecting points is at a first distance in a width direction of theground plane layer and at a second distance in the lengthwise dimensionof the ground plane layer, the first distance being between ⅓ and ⅔ (theendpoints being included) of a width of the ground plane layer, thesecond distance being between 0 and ⅙ (the endpoints being included) ofa length of the ground plane layer; the second connecting point of theat least three connecting points is at the first distance in the widthdirection of the ground plane layer and at a third distance in thelengthwise dimension of the ground plane layer, the third distance beingbetween 5/12 and 7/12 (the endpoints being included) of the length ofthe ground plane layer; and the third connecting point of the at leastthree connecting points is at the first distance in the width directionof the ground plane layer and at a fourth distance in the lengthwisedimension of the ground plane layer, the fourth distance being between ⅚and 6/6 (the endpoints being included) of the length of the ground planelayer.

In some embodiments, the at least two connecting points comprise four ormore connecting points (i.e. first, second, third and fourth, andpossibly even further connecting points); the at least two electricallyconductive elements comprise as many electrically conductive elements(i.e. first, second, third and fourth, and possibly even furtherelectrically conductive elements) as there are connecting points in theat least two connecting points; and the step of connecting the groundplane layer to the electrically conductive body with the at least twoelectrically conductive elements further comprises: connecting eachconnecting point of the at least two connecting points to theelectrically conductive body with one of the at least two electricallyconductive elements.

In some embodiments, the at least one radiation booster or radiatingelement comprises a single radiation booster element. In someembodiments, the at least one radiation booster or radiating elementcomprises two or three radiation booster elements electricallyconnected.

In some embodiments, the at least one radiation booster or radiatingelement comprises a radiating element.

In some embodiments, the radiating system further comprises a feedingsystem that electrically connects the at least one external port to theradiofrequency system. In these embodiments, the at least one externalport is provided in a part of the device (in a printed circuit boardthereof on which the radiating system is allocated) free from groundplane layer but proximate to it where fewer electric currents orelectric currents with lower intensity flow.

In some embodiments, each of the at least two electrically conductiveelements comprises a single component, the component being a via oralike.

In some embodiments, one, some or all of the at least two electricallyconductive elements (e.g. first, second, third, fourth, and/or evenfurther electrically conductive elements) comprises one of: a switch, acapacitor, an inductor, a resistor, a filter (e.g. low pass filter, highpass filter, band pass filter, stop band filter), a via or alike, and acombination thereof; and each of remaining electrically conductiveelements of the at least two electrically conductive elements comprisesa single component, the component being a via or alike.

In some embodiments, the distance is smaller than λ/15. In some of theseembodiments, the distance is smaller than λ/20. In some of theseembodiments, the distance is smaller than λ/30. In some cases, thedistance is at least equal to or greater than λ/100, for example equalto or greater than λ/50.

In some embodiments, a lowest frequency of operation of the radiatingsystem is equal to or greater than 50 MHz and is less than 100 GHz.

In some embodiments, the method further comprises providing the at leastone matching network so that the radiating system at least operates orfurther operates from 824 MHz to 960 MHz.

In some embodiments, the method further comprises providing the at leastone matching network so that the radiating system at least operates orfurther operates from 698 MHz to 960 MHz.

In some embodiments, the method further comprises providing the at leastone matching network so that the radiating system at least operates orfurther operates from 1710 MHz to 2690 MHz.

In some embodiments, the device is a wireless device. In some of theseembodiments, the wireless device is a portable wireless device.

In some embodiments, a width of the electrically conductive body isgreater than a width of the ground plane layer, and a length of theelectrically conductive body is greater than a length of the groundplane layer. In some of these embodiments, the width of the electricallyconductive body is smaller than 100 times the width of the ground planelayer, and the length of the electrically conductive body is smallerthan 100 times the length of the ground plane layer. In some of theseembodiments, the width of the electrically conductive body is smallerthan any one of the following: 50 times, 25 times, 10 times, 5 times and2 times the width of the ground plane layer; and the length of theelectrically conductive body is smaller than any one of the following:50 times, 25 times, 10 times, 5 times and 2 times the length of theground plane layer.

In some embodiments, the apparatus is one of: a smart TV, arefrigerator, a fridge, a washing machine, a drying machine, agas-meter, a water-meter, an electricity-meter, a motor vehicle, atrain, an airplane, a rocket, and a ship.

Similar advantages as those described for the first aspect of theinvention are also applicable to this aspect of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The mentioned and further features and advantages of the inventionbecome apparent in view of the detailed description which follows withsome examples of the invention, referenced by means of the accompanyingdrawings, given for purposes of illustration only and in no way meant asa definition of the limits of the invention.

FIGS. 1A-1B show, from two different views, a radiating system of adevice in accordance with an embodiment

FIGS. 2-6 diagrammatically show portions of ground plane layers whereconnecting points may be provided in accordance with embodiments.

FIGS. 7A-7C show different graphs in which radiation and antennaefficiencies of a device in free-space conditions, a device in closeproximity to an electrically conductive body and a device in accordancewith an embodiment are compared.

FIG. 8 shows an exemplary matching network.

FIG. 9 diagrammatically shows an exemplary arrangement of anelectrically conductive element in accordance with the presentdisclosure.

FIG. 10 diagrammatically shows exemplary paths followed by electriccurrents in a device in accordance with an embodiment.

FIGS. 11A-11B diagrammatically show a test platform for theelectromagnetic characterization of radiation booster elements.

FIG. 12 shows a graph with the radiation efficiency and antennaefficiency of a radiation booster element measured with the testplatform of FIGS. 11A-11B.

DETAILED DESCRIPTION

FIGS. 1A-1B show a device 5 in accordance with an embodiment of theinvention; FIG. 1A shows the device 5 from a top view whereas FIG. 1Bshows the device 5 from a side view.

The device 5 includes a radiating system that comprises a printedcircuit board 10, i.e. PCB, with a ground plane layer 15 (shown with astriped pattern for illustrative purposes only). The ground plane layer15 may be on one side of the printed circuit board 10 only or on bothsides of the printed circuit board 10, and in some cases even have oneor more ground plane layers within the printed circuit board 10; in anyof these cases, the different ground plane layers provided in the PCB 10are connected one to each other by means of via holes. The device 5further comprises at least one radiation booster or radiating element11. In this example, the device 5 comprises a single radiation boosterelement 11 mounted on the PCB 10, particularly in a portion thereof freefrom ground plane layer 15, and features dimensions of 12.0 mm×3.0mm×2.4 mm.

The radiation booster element 11 excites radiation modes in the groundplane layer 15. Since the radiation booster element 11 is mainlyreactive across the frequencies of operation, it is mismatched to animpedance of e.g. a signal transmitter or receiver, a modem or the likefor effecting communications by means of the radiating system, which isusually 50 ohms. The device 5 further comprises a radiofrequency system,which comprises a matching network 30 (in FIG. 1A only several pads areshown where components of the matching network are installed for thesake of clarity only) for matching purposes. The radiofrequency systemis electrically connected to both the radiation booster element 11 (bymeans of a feeding line 12, that is, for example a metallic strip or aconductive trace) and at least one external port 32. In this example,the matching network 30 comprises seven electrical components and isillustrated in FIG. 8 . Said radiation booster element 11, incombination with said radiofrequency system and the ground plane layer15, enables the operation of the radiating system in two frequencybands: from 824 MHz to 960 MHz, and from 1710 MHz to 2690 MHz.

The device 5 may also comprise a feeding system 34 that connects theradiofrequency system to the at least one external port 32, such as inthis example, but in other embodiments the radiofrequency system iselectrically connected to the at least one external port 32 without afeeding system 34, for example with a direct electrical connection froman end terminal of the at least one matching network 30 to the at leastone external port 32.

Beneath the device 5 is an apparatus having an electrically conductivebody 50. Such electrically conductive body 50, when it is proximate tothe radiating system of the device 5, influences the capability of theradiating system of radiating and/or capturing electromagnetic waves.The electrically conductive body 50 has electric currents flowingtherein that are coupled to the ground plane layer 15 of the radiatingsystem when the distance between the two is small. Normally, an averagedistance between the electrically conductive body 50 and the groundplane layer 15 must be small, meaning that the two are substantiallyparallel and one above or below the other so that there is at least somesuperposition between the two, as in FIGS. 1A-1B where there is completesuperposition: beneath the entire ground plane layer 15 is theelectrically conductive body 50. The distance is small when it is lessthan λ/10; by way of example the distance may also be smaller than anyone of the following values: λ/15, λ/20 and λ/30; wherein λ is afree-space wavelength at a lowest frequency of operation of theradiating system.

The device 5 is provided with two nylon spacers 37, 38 that maintain thedevice 5 attached to the electrically conductive body 50 such that thereis the distance D (shown in FIG. 1B) between the two. The electriccurrents that are coupled from the electrically conductive body 50 tothe ground plane layer 15 worsen the performance of the radiating systemby decreasing the efficiency thereof and increasing the impedancemismatch thereof.

In this example, the distance D is set to 10 mm. The radiating system ofthe device 5 operates from 824 MHz to 960 MHz and from 1710 MHz to 2690MHz, and thus the distance D is less than λ/10 and even less than λ/30for the free-space wavelength at 824 MHz.

A plurality of connecting points, in this example three connectingpoints 20-22, is provided in the ground plane layer 15. A plurality ofelectrically conductive elements, in this example three electricallyconductive elements 25-27 that comprise vias in the form of wire-madevias, is provided between the ground plane layer 15 and the electricallyconductive body 50 such that a plurality of electrical connections ismade between the two. The vias have a length equal to the distance D anda diameter of 1 mm.

The electrically conductive elements 25-27 alter the electric currentsinduced on the surface of the electrically conductive body 50, which arecoupled to the ground plane layer 15. The electric currents arepreferably altered so that at least some electric currents in theelectrically conductive body 50 are in-phase with at least some electriccurrents induced in the ground plane layer 15 owing to the excitation ofradiating modes by the radiation booster element 11. As the electriccurrents flowing in the electrically conductive body 50 are coupled tothe ground plane layer 50, the altered electric currents are alsocoupled thereto, thereby improving the operation of the radiatingsystem.

In some examples, one or more of the electrically conductive elements25-27 comprise different components and/or even two or more components;for example, switches, inductors, capacitors, filters, etc. Theprovision of such electrically conductive elements makes possible tofurther improve the operation of the radiating system by adjusting howthe electric currents flowing in the electrically conductive body 50 arealtered. Accordingly, by providing switches, inductors, capacitors,filters, etc. it is possible to adjust when the electric currents arealtered and for which frequencies the electric currents are altered.

The device 5 is an electronic device such as e.g. a mobile phone, asmartphone, a router, a communications module, a transceiver, a laptopcomputer, a tablet, a GPS system, a sensor, or generally a multifunctionwireless device which combines the functionality of multiple devices).

The radiation booster element 11 may be a radiation booster as describedin patent document WO-2016012507-A1, which is hereby incorporated byreference in its entirety. For instance, as described in lines 25-33 ofpage 9 and lines 1-10 of page 10 of said patent document, the radiationbooster element 11 includes a dielectric material and in someembodiments, a single standard layer of dielectric material spacing twoor more conductive elements. A single standard layer of dielectricmaterial refers to dielectric material with a standard thickness, whichis available off-the-shelf. For example, 0.025″ (0.635 mm), 0.047″ (1.2mm), 0.093″ (2.36 mm) or 0.125″ (3.175 mm) are common/standardthicknesses for dielectric materials which are available in the market.Examples of dielectric materials include fiber-glass FR4, Cuclad,Alumina, Kapton, Ceramic and for instance commercial laminates andsubstrates from Rogers® Corporation (R03000@ and R04000® laminates,Duroid substrates and alike) or other suitable non-conductive materials.The radiation booster element 11 may be formed by printing or depositingconductive material in a first and a second surface of the dielectricmaterial (e.g. top and bottom) and adding several vias to electricallyconnect the conductive material in the first surface with the conductivematerial in the second surface. The conductive material in the first andsecond surfaces may have a substantially polygonal shape. Some possiblepolygonal shapes are for instance, but not limited to, squares,rectangles, and trapezoids. When the conductive material in said firstand second surfaces has an elongated shape, for instance a rectangularshape, the radiation booster element takes the form of a booster bar; abooster bar may also include vias that electrically connect theconductive material in the first surface with the conductive material inthe second surface.

In some embodiments, the radiation booster element 11 has a size asdescribed in lines 24-34 of page 12, lines 1-34 of page 13, and lines1-6 of page 14 of said patent document, thus the maximum size is atleast smaller than 1/15 of the free-space wavelength corresponding tothe lowest frequency of operation. In some cases, said maximum size mayalso be smaller than any one of the following values: 1/20, 1/25, 1/30,1/50, and/or 1/100 of the free-space wavelength corresponding to thelowest frequency of operation. Additionally, in some of these examplesthe radiation booster element 11 has a maximum size larger than any oneof the following values: 1/1400, 1/700, 1/350, 1/250, 1/180, 1/140,and/or 1/120 times the free-space wavelength corresponding to the lowestfrequency of operation. The maximum size of the radiation boosterelement 11 is preferably defined by the largest dimension of a boosterbox that completely encloses said radiation booster element 11, and inwhich the radiation booster element 11 is inscribed. More specifically,a booster box for a radiation booster element 11 is defined as being theminimum-sized parallelepiped of square or rectangular faces thatcompletely encloses the radiation booster element 11 and wherein eachone of the faces of said minimum-sized parallelepiped is tangent to atleast a point of said radiation booster element 11. Moreover, eachpossible pair of faces of said minimum-size parallelepiped sharing anedge forms an inner angle of 90°.

Different matching networks 30 are possible within the scope of thepresent disclosure, for example but not limited to, those described inpatent document WO-2016012507-A1.

FIGS. 2-4 diagrammatically show portions of a ground plane layer 100where connecting points may be provided in accordance with embodiments.The ground plane layer 100 of a device is provided on a PCB thereof andhas a rectangular shape. The ground plane layer 100 has a lengthwisedimension defining a length L, and a width dimension defining a width W.By way of example, the length L is 120 mm and the width W is 60 mm, butother lengths and widths are also possible within the scope of thepresent disclosure.

In FIG. 2 , the ground plane layer 100 has first, second and thirdportions 101-103 (shown with a striped pattern for illustrative purposesonly, but it is readily apparent that they are part of the ground planelayer 100) in which connecting points may be provided.

The first portion 101 is at a first end of the ground plane layer 100,and coincides with a first edge thereof that extends in a directioncorresponding to the width dimension; the first portion 101 extends alength L/6 along the lengthwise dimension of the ground plane layer 100and has a width W. The second portion 102 is at a central part (at alength of L/2) of the ground plane layer 100 and extends a length L/6along the lengthwise dimension of the ground plane layer 100 and has awidth W. The third portion 103 is at a second end of the ground planelayer 100, and coincides with a second edge thereof that extends in adirection corresponding to the width dimension; the third portion 101extends a length L/6 along the lengthwise dimension of the ground planelayer 100 and has a width W.

Each of the connecting points (not illustrated) may be provided in anypart of one of the three portions 101-103 so that the connecting pointsare spaced apart one relative to each other. In some examples, theconnecting points are each provided in one of the three portions 101-103such that they are on or proximate to a central axis 150 (shown with adashed line for illustrative purposes only) of the ground plane layer100, which goes along the lengthwise dimension thereof.

In FIG. 3 , the ground plane layer 100 has first, second and thirdportions 111-113 (shown with a striped pattern for illustrative purposesonly, but it is readily apparent that they are part of the ground planelayer 100) in which connecting points may be provided.

Each of the first, the second and the third portions 111-113 extend asame length as the three portions 101-103 of FIG. 2 , but the widththereof is different. The first, the second and the third portions111-113 have a width W/3 (which in this example coincides with L/6 owingto the dimensions of the ground plane layer 100). In this example, halfof the width thereof extends from one side of the central axis 150 andthe other half of the width thereof extends from the other side of thecentral axis 150. In some examples, the width of the first, the secondand the third portions 111-113 is between 0.05λ and 0.06λ, and in someexamples between 0.0535λ and 0.0545λ, where X is a free-space wavelengthcorresponding to a lowest frequency of operation of the radiatingsystem.

In FIG. 4 , the same portions 111-113 of the example of FIG. 3 areshown, but also illustrated herein are first, second and thirdconnecting points 201-203. The connecting points 201-203 are provided atthe center of the portions 111-113 such that they coincide with thecentral axis 150. The distances between the first and the secondconnecting points 201-202, and between the second and the thirdconnecting points 202-203 are the same, which is 5 L/12. In someexamples, the distance between the first and the second connectingpoints 201-202 and the distance between the second and the thirdconnecting points 202-203 are between 0.1λ and 0.4λ, for example between0.11λ and 0.324λ, and in some examples between 0.135λ and 0.145λ alongthe central axis 150.

FIG. 5 diagrammatically shows portions of a ground plane layer 130 whereconnecting points may be provided in accordance with embodiments. Theground plane layer 130 of a device is provided on a PCB thereof and hasan irregular shape. The ground plane layer 130 has a lengthwisedimension defining a length L, and a width dimension defining a width W.By way of example, the length L is 110 mm and the width W is 55 mm, butother lengths and widths are also possible within the scope of thepresent disclosure.

The ground plane layer 130 has first, second and third portions 131-133(the first and the third portions 131, 133 are shown with a stripedpattern for illustrative purposes only, but it is readily apparent thatthey are part of the ground plane layer 130) in which connecting pointsmay be provided.

Each of the three portions 131-133 corresponds to a third of the groundplane layer 130 along the lengthwise dimension thereof, thus eachportion 131-133 has a length of L/3. The first portion 131 is at a firstend of the ground plane layer 130, and coincides with a first edgethereof that extends in a direction corresponding to the widthdimension; the first portion 131 has a width that is less than W. Thesecond portion 132 is at a center of the ground plane layer 130 and hasa width that is less than W, but is greater than the width of the firstportion 131. The third portion 133 is at a second end of the groundplane layer 130, and coincides with a second edge thereof that extendsin a direction corresponding to the width dimension; the third portion133 has a same width as the second portion 132.

Each of the connecting points (not illustrated) may be provided in anypart of one of the three portions 131-133 such that they are spacedapart one relative to each other. In some examples, the connectingpoints are each provided in one of the three portions 131-133 such thatthey are on or proximate to the central axis 150 of the ground planelayer 130.

FIG. 6 diagrammatically shows portions of a ground plane layer 140 whereconnecting points may be provided in accordance with embodiments.

The ground plane layer 140 of a device comprises first and second groundplane layers 141, 142 that are provided on a same PCB of the device oron different PCBs of the device. The first and the second ground planelayers 141, 142 have an irregular shape and are electrically connectedwith at least one electrically conductive element 143. The ground planelayer 140 has a lengthwise dimension defining a length L, and a widthdimension defining a width W when both the first and the second groundplane layers 141, 142 are fixedly attached to the device. The placementof the ground plane layers 141, 142 inside the device is important forthe location of the connecting points because it establishes thelocation where the electric currents will be altered on the surface ofan electrically conductive body of an apparatus. By way of example, thelength L is 100 mm and the width W is 50 mm, but other lengths andwidths are also possible within the scope of the present disclosure.

The ground plane layer 140 has first, second, third and fourth portions145-148 (the first and the third portions 145, 147 are shown with astriped pattern for illustrative purposes only, but it is readilyapparent that they are part of the ground plane layer 140) in whichconnecting points may be provided. In this example, the first and thesecond portions 145, 146 are in the first ground plane layer 141, afirst part of the third portion 147 is in the first ground plane layer141 and a second part of the third portion 147 is in the second groundplane layer 142, and the fourth portion 148 is in the second groundplane layer 142.

Each of the four portions 145-148 corresponds to a fourth of the groundplane layer 140 along the lengthwise dimension thereof, thus eachportion 145-148 has a length of L/4. The first portion 145 is at a firstend of the ground plane layer 140, and coincides with a first edgethereof that extends in a direction corresponding to the widthdimension; the first portion 145 has a width that is less than W. Thesecond portion 146 is between the first portion 145 and the thirdportion 147 (i.e. it extends between L/4 and L/2 of the lengthwisedimension of the ground plane layer 140) and has a width that is lessthan the width of the first portion 145. The third portion 147 is at apart of the first ground plane layer 141 having a second end thereof andalso at a part of the second ground plane layer 142 having a first endthereof; the third portion 147 has a width that is less than W butgreater than the widths of the first and the second portions 145, 146.The fourth portion 148 is at a part of the second ground plane layer 142having a second end thereof and coincides with a second edge of theground plane layer 140 that extends in a direction corresponding to thewidth dimension; the fourth portion 148 has a width that is less than W.

The connecting points 201-204 are in one of the four portions 145-148such that they are spaced apart one relative to each other. In thisexample, the connecting points 201-204 are on or proximate to thecentral axis 150 of the ground plane layer 140. In some otherembodiments, several connecting points are arranged on a same portion ofthe four portions 145-148, for example when six connecting points areprovided, two may be in the first portion 145, two other points in thesecond portion 146, one other point in the third portion 147 and a lastpoint in the fourth portion 148. Different combinations are possiblewithin the scope of the present disclosure.

FIGS. 7A-7C show different graphs in which radiation and antennaefficiencies of a device in free-space conditions, a device in closeproximity to an electrically conductive body and a device in accordancewith an embodiment are compared.

In FIG. 7A is shown the radiation and antenna efficiencies 250, 251(shown with dashed and solid lines, respectively) of a device such asthe device 5 of FIGS. 1A-1B in free-space conditions, that is to say,not in close proximity to the electrically conductive body 50 andwithout any electrically conductive elements connected thereto. Thedevice features a radiation efficiency 250 ranging from 70% up to 85%and an antenna efficiency 251 ranging from 55% up to 80% in the 824 MHzto 960 MHz band whereas, whereas the radiation efficiency 250 rangesfrom 75% up to 90% and the antenna efficiency 251 ranges from 65% up to85% in the 1710 MHz to 2690 MHz band.

In FIG. 7B, there is shown the radiation and antenna efficiencies in thelower frequency band of the same device when it is in close proximity tothe electrically conductive body, particularly when provided withconnecting points and electrically conductive elements connecting it tothe electrically conductive body and when it is not provided with suchconnecting points and electrically conductive elements. In the lattercase, the radiation efficiency 260 (shown with a dashed line) rangesfrom 18% up to 60% and the antenna efficiency 261 (shown with a solidline) ranges from 10% up to 24% in the 824 MHz to 960 MHz band, whereasin the former case the radiation efficiency 265 (shown with a dashedline with dashes shorter than those of the dashed line of the radiationefficiency 260) ranges from 50% up to 75% and the antenna efficiency 266(shown with a dotted line) ranges from 40% up to 73% in the same band.In this particular example, there is an improvement of up to 6 dB inradiation efficiency 265 (an improvement over 1:4) at frequencies in theband up to around 900 MHz, raising the efficiency from around 10-15% toover 60% at the lower frequencies of the band, for instance at 824 MHz;at higher frequencies in the band, the improvement is smaller. In thisexample, the efficiency at the higher frequency band (1710 MHz to 2690MHz) is preserved compared to a free-space case, i.e. in absence of aconductive body, this is because the device and the electricallyconductive body are not proximate in terms of the free-space wavelengthat said frequencies. In some examples, the efficiency of the radiatingsystem is improved in the same bands of operation or in other part(s) ofthe electromagnetic spectrum where the improve in efficiency enables theuse of further bandwidth(s); for example the efficiency may be improved0.5 dB or more, such as 1 dB, 2 dB, 3 dB, 6 dB or even more. This isillustrated in FIG. 7C, where the radiation and antenna efficiencies270, 271 (shown with dashed and solid lines, respectively) of the device5 of FIGS. 1A-1B are shown. In comparison with the free-space case ofFIG. 7A, the radiating system has improved both the radiation andantenna efficiency 270, 271 in a frequency range at about 1400 MHz,thereby enabling the radiating system to operate in one more band ofoperation.

FIG. 8 shows an exemplary matching network 80 that is to be installed inthe pads of the printed circuit board 10 corresponding to the locationof the matching network 30 of the device 5.

The matching network 80 is connected to the at least one radiationbooster 11 of the device 5 of FIGS. 1A-1B from one side, and to the atleast one external port 32 from the other side. The matching network 80comprises: a first inductor 81 with an inductance of 4.3 nH: a secondinductor 82 with an inductance of 18 nH; a first capacitor 83 with acapacitance of 0.9 pF; a second capacitor 84 and a third inductor 85with a capacitance of 1.0 pF and an inductance of 13 nH, respectively; athird capacitor with a capacitance of 2.0 pF; and a fourth inductor withan inductance of 4.5 nH.

It is readily apparent that, in other embodiments, different matchingnetworks are possible within the scope of the present disclosure.

FIG. 9 diagrammatically shows an exemplary arrangement of anelectrically conductive element in accordance with the presentdisclosure. In FIG. 9 there is partially represented a device with aprinted circuit board 10, which comprises a ground plane layer 15 thatis in close proximity (in terms of the operating free-space wavelength)to an electrically conductive body 50 of an apparatus (partiallyrepresented in FIG. 9 for the sake of clarity only).

An electrically conductive element for connecting a connecting point ofthe ground plane layer 15 to the electrically conductive body 50comprises first and second components 41, 27. The first component 41 isan inductor, which is arranged on a same plane of the ground plane layer15 such that a first terminal thereof is connected to the connectingpoint and a second terminal thereof is connected to a soldering pad 16.The second component 27 is a wire-made via having a first terminalthereof connected to the soldering pad 16 and a second terminal thereofconnected to the electrically conductive body 50. The first and thesecond components 41, 27 are arranged in series and adapted to alter theelectric currents flowing in the electrically conductive body 50. Inother embodiments, other components are provided in the electricallyconductive element and may be arranged differently, for exampleconnected in shunt and/or not coplanar with the ground plane layer 15.

In some other embodiments, one or more components are provided in theelectrically conductive body 50, said one or more components beingelectrically connected to the ground plane of the electricallyconductive body 50. The electrically conductive element is thus formedby both the component or components in the device and the one or morecomponents in the electrically conductive body 50. The component orcomponents of the device establish the electrical connection between theground plane layer 15 thereof and the ground plane layer of theelectrically conductive body 50, the electrical connection beingestablished through the one or more components in the electricallyconductive body 50.

FIG. 10 diagrammatically shows exemplary paths followed by electriccurrents in a device in accordance with an embodiment of the presentinvention.

A side view of a device is represented in which only the ground planelayer 15 and five electrically conductive elements 25-29 are shown forthe sake of clarity. The electrically conductive elements 25-29 connectfive different connecting points of the ground plane layer to anelectrically conductive body 50 of an apparatus.

Depending on the distribution of the connecting points and thecomponents of the electrically conductive elements 25-29, the differentconnections between the ground plane layer 15 and the electricallyconductive body 50 are established for different ranges of frequencies,thereby providing different paths for the electric currents flowingtherein. For example, shown with a dashed line is a first path 91followed by electric currents of a first wavelength or frequency; thefirst path 91 goes through two different connections of the electricallyconductive elements 28, 29. Further, shown with a dashed line is asecond path 92 followed by electric currents of a second wavelength orfrequency; the second path 92 goes through three different connectionsof the electrically conductive elements 25-27 and has a length longerthan the first path 91. Also, shown with a solid line is a third path 93followed by electric currents of a third wavelength or frequency; thethird path 93 goes through four different connections of theelectrically conductive elements 25-28 and has a length longer than thesecond path 92.

By adjusting how the induced electric currents flowing on the conductivebody are altered and the paths followed by electric currents ofdifferent frequencies or wavelengths, the radioelectric performance ofthe radiating system is improved, not only in terms of reducing thedecrease of performance owing to the close proximity of the electricallyconductive body 50 but also in terms of further bandwidth provided, suchan improvement evidenced by an increase in efficiency in one or morebands.

The behavior of the device of the embodiment of FIG. 10 is alsoapplicable to devices in accordance with other embodiments in which theground plane layer has two or more connecting points. There is a greaterflexibility in the configuration of the different paths for electriccurrents of different frequencies or wavelengths as more connectingpoints are provided; in this sense, devices in which the ground planelayer has four or more connecting points are more suitable for providingdifferent paths for the electric currents and, thus, improve evenfurther the bandwidth of operation of the radiating system.

FIG. 11A diagrammatically shows, in a 3D perspective, a test platformfor the characterization of radiation booster elements.

Radiation booster elements such as the radiation booster element 301 ofthe device 5 have an electromagnetic behavior that may be characterizedby means of a test platform for electromagnetically characterizingradiation boosters, as described in lines 9-34 of page 20 of saiddocument. Said platform comprises a substantially square conductivesurface 300 on top of which, and substantially close to the centralpoint, the element to be characterized is mounted perpendicular to saidsurface in a monopole configuration, said conductive surface acting asthe ground plane. The substantially square conductive surface 300comprises sides with a dimension larger than a reference operatingwavelength. In the context of the present invention, said referenceoperating wavelength is the free-space wavelength equivalent to afrequency of 900 MHz. A substantially square conductive surfaceaccording to the present invention is made of copper with sidesmeasuring 60 centimeters, and a thickness of 0.5 millimeters.

In the test configuration as set forth above, a radiation boosterelement 11 may be characterized by a ratio between the first resonancefrequency and the reference frequency (900 MHz) being larger than aminimum ratio of 3.0. In some cases, said ratio may be even larger thana minimum ratio such as any one of the following values: 3.4, 3.8, 4.0,4.2, 4.4, 4.6, 4.8, 5.0, 5.2, 5.4, 5.6, 5.8, 6.0, 6.2, 6.6 or 7.0.

A radiation booster element 11 may also be characterized by a radiationefficiency measured in said platform, at a frequency equal to 900 MHz,being less than 50%, preferably being less than 40%, 30%, 20%, or 10%,and in some cases being less than 7.5%, 5%, or 2.5%. All those are quiteremarkably low efficiency values.

The platform comprises the substantially square conductive surface 300and a connector 305 (for instance an SMA connector) electricallyconnected to the device or element 301 to be characterized. Theconductive surface 300 has sides with a length greater than thereference operating wavelength corresponding to the reference frequency.For instance, at 900 MHz, said sides are at least 60 centimeters long.The conductive surface may be a sheet or plate made of copper, forexample. The connector 305 is placed substantially in the center ofconductive surface 300.

In FIG. 11B the same test platform is diagrammatically represented in a2D perspective wherein the conductive surface 300 is partially drawn. Inthis example, the element that is to be characterized is a radiatingbooster element 301, which is arranged so that its largest dimension isperpendicular to the conductive surface 300, and one of the first orsecond conductive surfaces of the radiating booster element 301 is indirect electrical contact with the connector 305 (for clearerinterpretation of the orientation of the radiation booster element 301,via holes 302 connecting the first and second conductive surfaces of theradiation booster element 301 are also drawn in FIG. 11B). The radiationbooster element 301 lies on a dielectric material (not shown) attachedto the conductive surface 300 so as to minimize the distance betweenradiation booster element 301 and the surface 300. Said dielectricmaterial may be a dielectric tape or coating, for example.

FIG. 12 shows a graph of the radiation efficiency and antenna efficiencymeasured in a test platform like the one shown in FIGS. 11A-11B, whenthe element 301 to be characterized is a radiation booster element 301.In this particular example, the radiation efficiency measured 310 (shownwith a solid line) at 900 MHz is less than 5%, and the antennaefficiency measured 311 (shown with a dashed line) at 900 MHz is lessthan 1%.

Even though the terms first, second, third, etc. have been used hereinto describe several devices, elements or magnitudes, it will beunderstood that the devices, elements or magnitudes should not belimited by these terms since the terms are only used to distinguish onedevice, element or magnitude from another. For example, the firstconnecting point could as well be named second connecting point and thesecond connecting point could be named first connecting point withoutdeparting from the scope of this disclosure.

In this text, the term “comprises” and its derivations (such as“comprising”, etc.) should not be understood in an excluding sense, thatis, these terms should not be interpreted as excluding the possibilitythat what is described and defined may include further elements, steps,etc.

On the other hand, the invention is obviously not limited to thespecific embodiment(s) described herein, but also encompasses anyvariations that may be considered by any person skilled in the art (forexample, as regards the choice of materials, dimensions, components,configuration, etc.), within the general scope of the invention asdefined in the claims.

What is claimed is:
 1. A device including a radiating system, theradiating system comprising: at least one of a radiation booster or aradiating element; a ground plane layer having at least first and secondconnecting points; a radiofrequency system electrically connected to theat least one of a radiation booster or a radiating element andcomprising at least one matching network; at least one external portelectrically connected to the radiofrequency system; and at least firstand second electrically conductive elements, each comprising one or morecomponents and being adapted to electrically connect the first andsecond connecting points, respectively, to an electrically conductivebody of an apparatus at a distance from the ground plane layer, thedistance being less than λ/15, wherein λ is a free-space wavelength at alowest frequency of operation of the radiating system.
 2. The device ofclaim 1, wherein the at least one of a radiation booster or a radiatingelement comprises: a single radiation booster element; or two or threeradiation booster elements electrically connected.
 3. The device ofclaim 1, wherein the radiating system further comprises a feeding systemthat electrically connects the at least one external port to theradiofrequency system.
 4. The device of claim 1, wherein: the groundplane layer includes a third connecting point; the first connectingpoint is within a first third of the ground plane layer in a lengthwisedimension thereof, the second connecting point is within a second thirdof the ground plane layer in the lengthwise dimension thereof, and thethird connecting point is within a third third of the ground plane layerin the lengthwise dimension thereof; and the radiating system furtherincludes a third electrically conductive element adapted to electricallyconnect the third connecting point to the electrically conductive body.5. The device of claim 4, wherein: the first connecting point is at afirst distance in a width direction of the ground plane layer and at asecond distance in the lengthwise dimension of the ground plane layer,the first distance being between ⅓ and ⅔ of a width of the ground planelayer, the second distance being between 0 and ⅙ of a length of theground plane layer; the second connecting point is at the first distancein the width direction of the ground plane layer and at a third distancein the lengthwise dimension of the ground plane layer, the thirddistance being between 5/12 and 7/12 of the length of the ground planelayer; and the third connecting point is at the first distance in thewidth direction of the ground plane layer and at a fourth distance inthe lengthwise dimension of the ground plane layer, the fourth distancebeing between ⅚ and 6/6 of the length of the ground plane layer.
 6. Thedevice of claim 4, wherein: the ground plane layer further includes fouror more connecting points; and the radiating system includes as manyelectrically conductive elements as there are connecting points, each ofthe electrically conductive elements being adapted to electricallyconnect one of the connecting points to the electrically conductivebody.
 7. The device of claim 1, wherein each of the at least first andsecond electrically conductive elements comprises one of: a switch, acapacitor, an inductor, a resistor, a filter, a via, and a combinationthereof.
 8. The device of claim 1, wherein the device is a wirelessdevice and the radiating system operates from 824 MHz to 960 MHz and/orfrom 1710 MHz to 2690 MHz.
 9. A system comprising: the device of claim1; and the apparatus comprising the electrically conductive body. 10.The system of claim 9, wherein: a width of the electrically conductivebody is greater than a width of the ground plane layer; a length of theelectrically conductive body is greater than a length of the groundplane layer; and the apparatus is one of: a smart TV, a refrigerator, awashing machine, a drying machine, a gas-meter, a water-meter, anelectricity meter, a motor vehicle, a train, an airplane, a rocket, anda ship.
 11. A device including a radiating system, the radiating systemcomprising: at least one of a radiation booster or a radiating element;a ground plane layer comprising at least first and second connectingpoints; a radiofrequency system electrically connected to the at leastone of a radiation booster or a radiating element and comprising atleast one matching network; at least one external port electricallyconnected to the radiofrequency system; at least first and secondelectrically conductive elements, each comprising one or more componentsand adapted to electrically connect the first and second connectingpoints, respectively, to an electrically conductive body of an apparatusat a distance from the ground plane layer, the distance being less thanλ/15, wherein λ is a free-space wavelength at a lowest frequency ofoperation of the radiating system; and each of the at least first andsecond electrically conductive is further adapted to induce electriccurrents in the ground plane layer that are in-phase with respect to atleast some electric currents induced in the ground plane layer by the atleast one of a radiation booster or a radiating element.
 12. The deviceof claim 11, wherein the at least one of a radiation booster or aradiating element comprises: a single radiation booster element; or twoor three radiation booster elements electrically connected.
 13. Thedevice of claim 11, wherein the radiating system further comprises afeeding system that electrically connects the at least one external portto the radiofrequency system.
 14. The device of claim 11, wherein: theground plane layer includes a third connecting point; the firstconnecting point is within a first third of the ground plane layer in alengthwise dimension thereof, the second connecting point is within asecond third of the ground plane layer in the lengthwise dimensionthereof, and the third connecting point is within a third of the groundplane layer in the lengthwise dimension thereof; and the radiatingsystem further includes a third conductive element adapted toelectrically connect the third connecting point to the electricallyconductive body.
 15. The device of claim 14, wherein: the firstconnecting point is at a first distance in a width direction of theground plane layer and at a second distance in the lengthwise dimensionof the ground plane layer, the first distance being between ⅓ and ⅔ of awidth of the ground plane layer, the second distance being between 0 and⅙ of a length of the ground plane layer; the second connecting point isat the first distance in the width direction of the ground plane layerand at a third distance in the lengthwise dimension of the ground planelayer, the third distance being between 5/12 and 7/12 of the length ofthe ground plane layer; and the third connecting point is at the firstdistance in the width direction of the ground plane layer and at afourth distance in the lengthwise dimension of the ground plane layer,the fourth distance being between ⅚ and 6/6 of the length of the groundplane layer.
 16. The device of claim 14, wherein: the ground plane layerfurther includes four or more connecting points; and the radiatingsystem includes as many electrically conductive elements as there areconnecting points, each of the electrically conductive elements beingadapted to electrically connect one of the connecting points to theelectrically conductive body.
 17. The device of claim 11, wherein eachof the at least first and second electrically conductive elementscomprises one of: a switch, a capacitor, an inductor, a resistor, afilter, a via, and a combination thereof.
 18. The device of claim 11,wherein the device is a wireless device and the radiating systemoperates from 824 MHz to 960 MHz and/or from 1710 MHz to 2690 MHz.
 19. Asystem comprising: the device of claim 11; and the apparatus comprisingthe electrically conductive body.
 20. A method comprising: providing adevice including a radiating system, the radiating system comprising: atleast one of a radiation booster or a radiating element; a ground planelayer including at least first and second connecting points; aradiofrequency system electrically connected to the at least one of aradiation booster or a radiating element and comprising at least onematching network; and at least one external port electrically connectedto the radiofrequency system; providing an apparatus comprising anelectrically conductive body such that the ground plane layer is at adistance from the electrically conductive body, the distance beingsmaller than λ/15, wherein λ is a free-space wavelength at a lowestfrequency of operation of the radiating system; and providing at leastfirst and second electrically conductive elements each comprising one ormore components.